Ç¥ÁØÈ­ Âü¿©¾È³»

TTAÀÇ Ç¥ÁØÇöȲ

Ȩ > Ç¥ÁØÈ­ °³¿ä > TTAÀÇ Ç¥ÁØÇöȲ

Ç¥ÁعøÈ£ TTAK.KO-10.0322 ±¸Ç¥ÁعøÈ£
Á¦°³Á¤ÀÏ 2009-11-20 ÃÑÆäÀÌÁö 16
ÇѱÛÇ¥ÁØ¸í ¹Ð¸®¹ÌÅÍÆÄ ¼¼¶ó¹Í ÆÐÅ°ÁöÀÇ Àç·á ¹× ³»ºÎ¿¬°á¿¡ ´ëÇÑ Áöħ
¿µ¹®Ç¥Áظí Guideline for Millimeter-wave Band Ceramic Package - Part 1: Materials and Interconnections
Çѱ۳»¿ë¿ä¾à º» Ç¥ÁØ¿¡¼­´Â ¹Ð¸®¹ÌÅÍÆÄ ´ë¿ª ÆÐÅ°Áö Áß¿¡¼­ ÆÐÅ°Áö Àç·á¿Í ÆÐÅ°Áö ¸öü¿Í ÆÐÅ°Áö ³»ÀÇ Ä¨µé¿¡ ´ëÇÑ ³»ºÎ¿¬°á ºÎºÐ¿¡ ´ëÇÑ °¡À̵å¶óÀÎÀ» Á¦°øÇÏ°íÀÚ ÇÑ´Ù.
¿µ¹®³»¿ë¿ä¾à In this standard, we give a guideline for package materials and interconnections between package body and chips in the millimeter-wave package.
±¹Á¦Ç¥ÁØ
°ü·ÃÆÄÀÏ TTAK.KO-10.0322.zip TTAK.KO-10.0322.zip            

ÀÌÀü
¼ö¸é°ü¸® ¼­ºñ½º ÇÁ·¹ÀÓ¿öÅ© - Á¦3ºÎ: µ¥ÀÌÅÍ ¸ðµ¨
´ÙÀ½
Áö´ÉÇü µð¹ÙÀ̽ºµéÀ» À§ÇÑ ¿¡Áö ÄÄÇ»Æà °ü¸® ÀÎÅÍÆäÀ̽º