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Ç¥ÁعøÈ£ TTAK.KO-10.1432 ±¸Ç¥ÁعøÈ£
Á¦°³Á¤ÀÏ 2023-12-06 ÃÑÆäÀÌÁö 13
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¿µ¹®Ç¥Áظí Non-lead Surface Mount Device (SMD) Type Chip Tensile Pull Test Method
Çѱ۳»¿ë¿ä¾à ÀÌ Ç¥ÁØÀº ´Ù¾çÇÑ À¯ÇüÀÇ ±âÆÇ¿¡ ¼Ö´õ¹üÇÁ·Î Á¢ÇÕµÈ ¸®µå°¡ ¾ø´Â Ç¥¸é ½ÇÀåÇü ĨÀÇ ÀÎÀå°­µµ¸¦ Æò°¡ÇÏ´Â µ¥ Àû¿ëµÊ. ±¸Ã¼ÀûÀ¸·Î ±âÆÇÀº Àμâȸ·Î±âÆÇ, À¯¿¬Àμâȸ·Î±âÆÇ, ½ÅÃ༺ȸ·Î±âÆÇ µîÀÌ ÇØ´çµÇ¸ç, ¸®µå°¡ ¾ø´Â Ç¥¸é ½ÇÀåÇü ĨÀº Quad Flat Non-leaded (QFN) Package°¡ ÇØ´çµÈ´Ù.
¿µ¹®³»¿ë¿ä¾à The standard is applied to evaluate the tensile strength of Non-lead surface-mounted chips soldered to various types of boards. Specifically, printed circuit boards, flexible printed circuit boards, and stretchable circuit boards are included in substrates, and the non-lead surface mounted chips comprehend Quad Flat Non-leaded (QFN) package.
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