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Ç¥ÁعøÈ£ [ÆóÁö] TTAK.KO-12.0088 ±¸Ç¥ÁعøÈ£
Á¦°³Á¤ÀÏ 2008-12-19 ÃÑÆäÀÌÁö 25
ÇѱÛÇ¥ÁØ¸í ¸ð¹ÙÀÏ Ç÷§Æû¿ë ½Å·Úº¸¾È¸ðµâ(MTM) ÀÎÅÍÆäÀ̽º
¿µ¹®Ç¥Áظí MTM Interface for Mobile Platforms
Çѱ۳»¿ë¿ä¾à º» Ç¥ÁØÀº º¸´Ù ¾ÈÀüÇÑ Â÷¼¼´ë À̵¿ Åë½ÅÀ» À§ÇØ MTM(Mobile Trusted Module)À» Àû¿ëÇÏ¿© ½Å·ÚÇÒ ¼ö ÀÖ´Â ¸ð¹ÙÀÏ Ç÷§ÆûÀ» Á¦°øÇÏ°íÀÚ ÇÒ ¶§,MTM°ú ¸ð¹ÙÀÏ Ç÷§Æû »çÀÌÀÇ ÀÎÅÍÆäÀ̽º¿¡ ´ëÇÑ Ç¥ÁØ ±Ô°ÝÀ» Á¤ÀÇÇÑ´Ù.
¿µ¹®³»¿ë¿ä¾à This standard describes the requirements for the physical characteristics between the MTM and the mobile platform, and provides the interface specification between both. Although it is possible to use a MTM in most of mobile platforms, the communication interface depends on the mobile platform manufacturers. Therefore, preferentially, for easier applying to various mobile platforms, the common interface specification should be defined. This standard defines electrical interface including voltage level, clock frequency, power consumption and so forth, the communication interface for data transfer and the package interface including pin numbers and chip area. And this standard defines the time-out for the MTM command processing, Self-Test and input buffer size, etc.
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