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¿µ¹® Ç¥Áظí Bonding Structure in a Information and Telecommunication Equipment Room or Closet to Ground and Equipotentialize
ÇÑ±Û ³»¿ë¿ä¾à Á¤º¸ Åë½Å Àåºñ½Ç ³»¿¡¼­ ÀüüÀûÀÎ ½Ã¼³ Àåºñ ¹× ¼³ºñÀÇ ±¸¼º°ú ÇÔ²² Á¢Áö ¹× µîÀüÀ§È­¸¦ À§ÇÏ¿© ±¸ÃàÇÏ´Â º»µù ¼±ÀÇ ¿¬°á ¹æ¹ýÀ» ±â¼úÇÑ´Ù. º¹¼öÀÇ ±¸¼º ÀåºñµéÀ» žÀçÇÏ¿© º¸°üÇÏ´Â ¼³ºñ(ijºñ³Ý ¶Ç´Â ·¢) ÀÚü¿¡¼­ÀÇ º»µù ¼± ±¸¼º ¹æ¹ý°ú ÀÌ·¯ÇÑ ¼³ºñ °£, ¶Ç´Â Àåºñ °£¿¡ ¿¬°áÇÏ´Â º»µù ¼±ÀÇ ±¸¼º ¹æ¹ý, Àåºñ½Ç ³» ¸ðµç ÇØ´ç ±¸¼º ½Ã¼³µé·ÎºÎÅÍ ¿¬°áµÇ¾î ³ª¿À´Â º»µù ¼±µéÀ» ÃÖÁ¾ÀÇ Á¢Áö±ØÀ¸·Î ¿¬°áÇϱâ Á÷ÀüÀÇ Á¢¼Ó ¸Å°³Ã¼ÀÎ ÁÖ Á¢Áö ´ÜÀڹݿ¡ ¿¬°áµÇµµ·Ï ±¸¼ºÇϴ ü°è¸¦ ´Ù·é´Ù.
¿µ¹® ³»¿ë¿ä¾à A construction method of bonding lines in an equipment room is presented with its position meaning in telecommunication network. Such a method is treated by components of equipment room. That is, an element for an entrance facility is figured out. Cabinet and racks as a main part of equipment room are composed for bonding connection system. Bonding structure for access floor is treated.
Bonding test requirement and administration is recorded.
°ü·Ã IPR È®¾à¼­ Á¢¼öµÈ IPR È®¾à¼­ ¾øÀ½
°ü·ÃÆÄÀÏ    TTAK.KO-04.0181.pdf TTAK.KO-04.0181.pdf
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2017-06-09 À¯Áö ÇöÀç °ü·Ã ¾÷°è¿¡¼­ »ç¿ëµÇ°í ÀÖÀ½.