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¿µ¹® Ç¥Áظí Safety plan for intensifying cybersecurity of artificial intelligence processor (Technical Report)
ÇÑ±Û ³»¿ë¿ä¾à ÀÌ ±â¼úº¸°í¼­´Â º¸¾È¼º °­È­°¡ ÇÊ¿äÇÑ ½Ã½ºÅÛ¿¡¼­ »ç¿ëÇÏ´Â ¹ÝµµÃ¼¿¡¼­ º¸¾È¼ºÀ» ³ôÀÏ ¼ö ÀÖ´Â ±â´É¾ÈÀü ¼³°è¿¡ ´ëÇÑ ¿¹Á¦¸¦ Á¦°øÇÑ´Ù. ÀΰøÁö´É ¹ÝµµÃ¼ ³»¿¡ ±â´É¾ÈÀü ±â¼úÀ» Æ÷ÇÔÇÏ´Â ±¸Á¶¸¦ ¼³¸íÇϰí, ÀÌ·¯ÇÑ ±¸Á¶¿¡¼­ ÀΰøÁö´É º¸¾È¼º °­È­¸¦ À§ÇÑ µ¿ÀÛ ¹æ½ÄÀ» ¼³¸íÇÑ´Ù. ¶ÇÇÑ º¸¾È¼º °­È­¸¦ À§ÇÑ ¼³°è°¡ Æ÷ÇÔµÈ ÀΰøÁö´É ÇÁ·Î¼¼¼­ ¹× ¹ÝµµÃ¼¿¡¼­ ÀΰøÁö´É ¾Ë°í¸®ÁòÀ» ¼öÇà ½Ã º¸¾È¼º °­È­ ±â´ÉÀ» À§ÇÑ µ¿ÀÛ ¿¹½Ãµµ ÇÔ²² ¼³¸íµÈ´Ù.
¿µ¹® ³»¿ë¿ä¾à The technical report includes the structure for intensifying cybersecurity of the semiconductor and the example for designing a safety feature of semiconductor for artificial intelligent system with intensified cybersecurity and the example for operating the semiconductor adapted to the reliable system with fault tolerant features and proving the performance of fault tolerance in the semiconductor.
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