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Ç¥ÁعøÈ£ | TTAK.KO-04.0182 | ±¸Ç¥ÁعøÈ£ | |
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Á¦°³Á¤ÀÏ | 2013-12-18 | ÃÑÆäÀÌÁö | 33 |
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¿µ¹®Ç¥Áظí | Telecommunications Grounding and Bonding for Customer Premises | ||
Çѱ۳»¿ë¿ä¾à | ÀÌ Ç¥ÁØÀº ±¸³» Åë½Å ½Ã½ºÅÛÀÇ Á¢Áö ¹× º»µù ½Ã½ºÅÛ ½Ã¼³À» À§ÇÏ¿© Á¢Áö¿Í º»µù ±â¹Ý ½Ã¼³ÀÇ °³³äÀ» ¼³¸íÇÏ°í º»µù µµÃ¼, º»µù °£¼±°è, Á¢Áö ´ÜÀÚ¹Ý ¹× °Ç¹°ÀÇ ±Ý¼Ó ÇÁ·¹ÀÓ°ú º»µù ±â¼ú µîÀÇ ±¸³» Åë½Å Á¢Áö¿Í º»µùÀÇ ±â¹Ý ½Ã¼³ ¿ä¼Ò¿¡ ´ëÇؼ ±â¼úÇÑ´Ù. ¶ÇÇÑ ÀÌ·¯ÇÑ ±¸³» Åë½Å ½Ã½ºÅÛÀÇ ½Ã¼³ ¿ëµµ¿¡ µû¶ó ÇÇ·Ú ½Ã½ºÅÛ°ú Àü·Â ½Ã½ºÅÛ¿¡ ´ëÇÑ Á¢Áö¿Í º»µù ±â¼úÀ» ´Ù·ç°í Åë½Å º»µù°ú Á¢ÁöÀÇ ½Ç·Ê¸¦ µé¾î ÀÌÇظ¦ µ½´Â´Ù. ¸¶Áö¸·À¸·Î ÇöÀå Àû¿ëÀÇ ÀÌÇظ¦ µ½±â À§ÇÏ¿© ¿©·¯ µ¿À¸·Î ÀÌ·ç¾îÁø °øµ¿ ÁÖÅà ´ÜÁö³ª Ä·ÆÛ½º ÇüÅÂÀÇ ±¸³» Åë½Å ½Ã½ºÅÛµéÀÌ µ¿ÀÏÇÑ Á¢Áö¿Í Àü·Â °ø±Þ ¼³ºñ¸¦ °¡Áú ¶§ÀÇ °¢ °Ç¹° °£ º»µù ½Ã¼³ ±â¼ú¿¡ ´ëÇؼ ´Ù·é´Ù. | ||
¿µ¹®³»¿ë¿ä¾à | This standard specifies the overview of the telecommunications bonding and grounding infrastructure for the premises and the telecommunications bonding and grounding components such as bonding conductor, bonding backbone, grounding busbar, and building steel. And this standard is including the grounding and bonding technology of lighting protection system and power system, a few examples of telecommunications grounding and bonding. Finally, bonding between buildings under the same grounding and power feeding conditions is dealt to facilitate the understanding of the application in the field. | ||
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°ü·ÃÆÄÀÏ | TTAK.KO-04.0182.pdf |