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¿µ¹®Ç¥Áظí Guideline for Millimeter-wave Band Ceramic Package - Part 1: Materials and Interconnections
Çѱ۳»¿ë¿ä¾à º» Ç¥ÁØ¿¡¼­´Â ¹Ð¸®¹ÌÅÍÆÄ ´ë¿ª ÆÐÅ°Áö Áß¿¡¼­ ÆÐÅ°Áö Àç·á¿Í ÆÐÅ°Áö ¸öü¿Í ÆÐÅ°Áö ³»ÀÇ Ä¨µé¿¡ ´ëÇÑ ³»ºÎ¿¬°á ºÎºÐ¿¡ ´ëÇÑ °¡À̵å¶óÀÎÀ» Á¦°øÇÏ°íÀÚ ÇÑ´Ù.
¿µ¹®³»¿ë¿ä¾à In this standard, we give a guideline for package materials and interconnections between package body and chips in the millimeter-wave package.
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