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Ç¥ÁعøÈ£ TTAK.KO-10.0459 ±¸Ç¥ÁعøÈ£
Á¦°³Á¤ÀÏ 2010-12-23 ÃÑÆäÀÌÁö 0
ÇѱÛÇ¥Áظí XMD-TOSA ÆÐÅ°Áö¿¡¼­ °íÁÖÆÄ ½ÅÈ£ÀÇ Àü±âÀû ¿¬°á ¹æ¹ý¿¡ ´ëÇÑ Áöħ
¿µ¹®Ç¥Áظí Guideline for the method of electrical interconnections of high speed signals in XMD-TOSA package
Çѱ۳»¿ë¿ä¾à 10Gbps ÀÌ»óÀÇ ±¤ ¼Û½Å ¹× ¼ö½Å±â¿¡¼­ °íÁÖÆÄ ½ÅÈ£¸¦ Àü¼Û ¹× ó¸®Çϱâ À§ÇÏ¿© ±Ý¼Ó ÆÐÅ°Áö ³»ºÎ¿¡´Â ¼¼¶ó¹Í ¼­ºê¸¶¿îÆ®¸¦ »ç¿ëÇÏ°í ÀÖÀ¸¸ç ±Ý¼Ó ÆÐÅ°Áö ¿ÜºÎ¿¡´Â flexible PCB(Printed Circuit Board)¸¦ »ç¿ëÇÑ´Ù. °íÁÖÆÄ ½ÅÈ£¸¦ ¹Ý»ç ¾øÀÌ Àü¼ÛÇϱâ À§ÇÏ¿© ¸ÅĪ ÀúÇ×À» ¼¼¶ó¹Í ¼­ºê¸¶¿îÆ® »ó¿¡ ¹Ú¸· ÇüÅ·ΠÁýÀûÇÒ »Ó ¾Æ´Ï¶ó °øÁø¿¡ ÀÇÇÑ °íÁÖÆÄ ½ÅÈ£ÀÇ ¿Ö°îÇö»óÀ» ¹æÁöÇϱâ À§ÇÏ¿© Á¢Áö(Ground) via hole¸¦ Çü¼ºÇÑ´Ù. »ó±â ¹Ú¸· ÇüÅÂÀÇ ¸ÅĪ ÀúÇ× ¹× Á¢Áö via holeÀ» ¼¼¶ó¹Í ¼­ºê¸¶¿îÆ® »ó¿¡ Çü¼ºÇÏ´Â °ÍÀº °í°¡ÀÇ °øÁ¤À¸·Î ÆÐÅ°Áö ºÎÀÚÀç °¡°ÝÀÇ »ó´çÇÑ ºÎºÐÀ» Â÷ÁöÇÑ´Ù. º» Ç¥ÁØ¿¡¼­´Â ÀÌ·¯ÇÑ °í°¡ÀÇ ¼¼¶ó¹Í ¼­ºê¸¶¿îÆ®¸¦ ´ëüÇϱâ À§ÇÏ¿© flexible PCB¸¦ ±Ý¼Ó ÆÐÅ°Áö ³»ºÎ±îÁö ¿¬Àå½Ãų »Ó ¾Æ´Ï¶ó ¹ÝµµÃ¼ Ĩ, ijÆнÃÅÍ(Capacitor) Ĩ, ¼­¹Ì½ºÅÍ(Thermistor) Ĩ µîÀ» ½ÇÀåÇϱâ À§ÇÑ MOB(Metal Optical Bench)¸¦ »ç¿ëÇÏ´Â °Í°ú °°Àº °íÁÖÆÄ ½ÅÈ£ÀÇ Àü±âÀû ¿¬°á ¹æ¹ý¿¡ °üÇÑ °¡ÀÌµå ¶óÀÎÀ» Á¦°øÇÏ°íÀÚ ÇÑ´Ù.
¿µ¹®³»¿ë¿ä¾à To tranmit high speed signals in the optical transmitter and receiver with data rates more than 10 Gbps, ceramic submounts are generally used inside the metal package, and flexible printed circuit boards (PCBs) are fixed to the outside of the metal package. A thin film matching resistor has been integrated on the ceramic submount to transmit the high speed signals without electrical reflection at a transmission line terminal, and ground via holes are formed to prevent signal distortion phenomenon. The processing cost of forming the thin film resistor and ground via holes on the ceramic submounts is very high and therefore occupies a lot of portion of cost of the pacakge subsidiary materials. To replace the expensive ceramic submount, this standard provides the guideline for the electrical interconnection method of high speed signals, which is related to extending the flexible PCB from the exterior of the metal package near to a semiconductor chip inside the metal package and related to integrating the semiconductor chip, capacitor chip, and thermistor chip on the metal optical bench.
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