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Ç¥ÁعøÈ£ TTAK.KO-10.0573 ±¸Ç¥ÁعøÈ£
Á¦°³Á¤ÀÏ 2012-10-09 ÃÑÆäÀÌÁö 15
ÇѱÛÇ¥ÁØ¸í ¿¬¼º Àμâ ȸ·Î ±âÆÇ°ú Àμâ ȸ·Î ±âÆÇ »çÀÌ¿¡¼­ °í¼Ó RF ½ÅÈ£ÀÇ ¿¬°á ±¸Á¶
¿µ¹®Ç¥Áظí Interconnection Structure of High Speed Radio-Frequency Signals between Flexible PCB and PCB
Çѱ۳»¿ë¿ä¾à º» Ç¥ÁØ¿¡¼­´Â ¿¬¼º Àμâ ȸ·Î ±âÆÇ°ú Àμâ ȸ·Î ±âÆÇÀÇ ¿¬°á ºÎºÐ¿¡¼­ ¹ß»ýÇÏ´Â ÀÓÇÇ´ø½º ºÎÁ¤ÇÕÀ» ÃÖ¼ÒÈ­ ½ÃÅ´°ú µ¿½Ã¿¡ 10~30Gbps ±Þ °íÁÖÆÄ ½ÅÈ£ÀÇ Àü¼Û Ç°ÁúÀ» Çâ»ó½ÃÅ°±â À§ÇÏ¿© ¿¬¼º Àμâ ȸ·Î ±âÆÇ ¹× Àμâ ȸ·Î ±âÆÇÀÇ °í¼Ó RF ½ÅÈ£ÀÇ ¿¬°á ±¸Á¶¸¦ Á¦°øÇÑ´Ù.
¿µ¹®³»¿ë¿ä¾à This standard provides the interconnection structure of high speed RF signals between the flexible PCB and the PCB, to minimize the impedance mismatch at the flexible PCB to PCB interconnection region and to enhance the transmission quality of high frequency signals in between 10 and 30 Gbps.
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